Description
Jul 31, 2015 8GB THGBMHG6C1LBAIL . INTRODUCTION. THGBMHG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG6C1LBAIL has an industry standard
Part Number | THGBMHG6C1LBAIL |
Main Category | Integrated Circuits (ICs) |
Sub Category | Memory |
Brand | Micron Technology |
Description | IC FLASH 64GBIT 52MHZ 153WFBGA |
Series | eMMC |
Packaging | Non-Volatile |
Memory Type | Tray |
Memory Format | FLASH |
Technology | FLASH - NAND |
Memory Size | 64Gb (8G x 8) |
Clock Frequency | 52MHz |
Write Cycle Time - Word, Page | - |
Access Time | - |
Memory Interface | MMC |
Voltage - Supply | 2.7 V ~ 3.6 V |
Operating Temperature | -25°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 153-WFBGA |
Supplier Device Package | 153-WFBGA (11.5x13) |
Image |
Hot Offer
THGBMHG6C1LBAIL
MICROSOFT
7600
0.13
Sinway International Co., Limited
THGBMHG6C1LBAIL
MIRCON
7778176
1.66
KHWY GROUP LIMITED
THGBMHG6C1LBAIL
MIRON
3000
3.19
Hongkong Dasenic Electronic Limited
THGBMHG6C1LBAIL
MICROCHIP TECHNOLOGY INC
2000
4.72
NAND FUND CHUEN SHING ELECTRONIC(SZ)CO.,LTD
THGBMHG6C1LBAIL
MICORON
2000
6.25
HONGKONG LIANZHENG TRADE CO., LIMITED